Raytac Corporation – U.S. Headquarters Relocation Notice

 New U.S. Headquarter Address:

17800 Castleton Street, Suite 238, City of Industry, CA 91748, USA
Phone: 626.328.3827
Our new location strengthens our operational capabilities in the United States, enabling faster logistics, enhanced customer support, and expanded service coverage. We look forward to continuing to serve our partners and customers from our new facility.

Join Raytac at "Embedded World 2025" – Experience Innovation at Our Booth!

 

Dear Valued Attendees,

We are thrilled to announce that Raytac Corporation will be participating in Embedded World 2025 from March 11 to March 13, 2025, at the Nuremberg Exhibition Centre in Germany.

IoT and Wireless technologies such as Bluetooth Low Energy (BLE), Wi-Fi, and LoRa...etc. continue to reshape industries worldwide, that's why Raytac is at the forefront, providing cutting-edge solutions that accelerate product development.
Together with our partner, Nordic Semiconductor, we offer a comprehensive range of modules designed to meet the increasing demands of today’s connected world.

This year, we have exciting innovations to showcase:

• Our new nRF7002 Wi-Fi module series (AN7002Q)
• The latest nRF54L15 series BLE modules (AN54LQ, AN54L15A, AN54LV)
• Our upcoming nRF54H20 series BLE modules (AN54H20)
• Our LoRa module AS1262-U, based on SemTech SX1262
• Unveiling our new service: Customized OEM/ODM designing for customers.

These are just a few of the groundbreaking solutions we’ll be unveiling. You won’t want to miss the chance to experience these with us!

What to Expect at Our Booth:

• Live demonstrations showing how Raytac’s modules can be implemented in multiple industries.
• Discover how our modules can reduce development time and costs, making your projects more efficient.
• One-on-one consultations with our experts to help you find the right solutions for your needs.

Stop by and visit us at:
HALL 3
Booth 3-111
M2M Area

We would love to connect with you and discuss how Raytac can support your next project. Whether you're an engineer, developer, or business decision-maker, we have something for everyone at Embedded World 2025.

For more details and a sneak peek of what we have in store, don’t forget to check out:
1. Our website: http://www.raytac.com
2. Our LinkedIn: https://www.linkedin.com/in/raytac/
3. Our WordPress Blog: https://raytac.blog/

We can’t wait to see you at the event and look forward to the opportunity to collaborate with you!

Understanding LE Audio: BIS and CIS Explored

 

LE Audio, introduced with Bluetooth 5.2, brings significant advancements to audio technology by using the Low Complexity Communication Codec (LC3). 
Compared to older codecs like SBC, LC3 provides better audio quality while reducing power consumption, making it ideal for devices like wireless earphones and hearing aids.

In this article, we’ll explore two key modes in LE Audio: Broadcast Isochronous Stream (BIS) and Connected Isochronous Stream (CIS). These modes cater to different use cases, offering flexible audio experiences.

Secure DFU OTA for nRF52832 solution modules: Creating hex/zip file for implementation – Part 2(Combining/merging built files)

 Following up – Part 1: Bootloader & Application (Click for article link),

We will be focusing on:

Part 2: Combining and merging built files

in this article.

IC: nRF52832
DK: PCA10040 (for nRF52832)
SDK: 16.0.0
Softdevice: s132_nrf52_7.0.1_softdevice.hex
IDE: Keil C
PC: Win 10

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Part 2: Combining and merging built files